Product Overview
Our high-performance phenolic molding compound (PF) is a thermosetting material engineered for extreme conditions, integrating advanced phenol-formaldehyde resin with inorganic fiber reinforcement and mineral fillers . Boasting exceptional heat resistance, mechanical strength, and electrical insulation, it meets global industry standards (UL 94, ISO 14526-3) and supports diverse molding processes. Ideal for automotive, electronics, and machinery sectors, it drives reliability in high-demand components .
Key Technical Parameters
| Property | Specification | Test Standard |
| Density | 1.85 g/cm³ | GB1033 |
| Heat Distortion Temp | 280°C | GB1634 |
| Impact Strength (Notched) | ≥36 kJ/m² | GB/T1043 |
| Flame Retardancy | UL94 V-0 | UL94 |
| Mold Shrinkage | 0.03% | JB/T6542 |
| Fluidity (Rheogoniometer) | 60-200mm | Customer Agreeme |
Application Fields
- Automotive: Commutators, belt pulleys, clutch components, and EV thermal management parts (resists high temperatures in engine bays) .
- Electronics: Coil bobbins, relays, microswitch housings, and high-voltage insulation terminals (meets PTI ≥175 standard) .
- Machinery: Pump casings, valve bodies, and precision instrument shells (withstands chemical corrosion and mechanical stress) .
Molding & Supply
- Processing: Adaptable to injection molding (barrel temp 70-100°C) and compression molding (165-175°C, 25-40MPa) .